FPC Lamination Machine

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Conductive adhesive die cutting and applying machine for Flex circuits

Application:

Adhesive cutting and applying for Flex PCB Assembly

Suitable for 3M, Tesa, Kapton, High temperature adhesive, Pressure sensitive adhesive, PI electromagnetic shielding film, etc

  • Product Details
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  • Machine Benifits:

    1. Wide range of application: 3M/ Tesa/ Kapton high temperature adhesive/ Pressure sensitive adhesive etc

    2. Tape cutting and applying fulfilled synchronously, high precision, high efficient, 10 times as skilled workers.

    3. Release film stripped off automatically.

    4. Servo motor and high pressure cylinder guarantee punching quality.

    5. High punching/applying speed 0.28 - 0.5 sec per time

    6. Repeatability accuracy ±0.005mm

    7. High accuracy ±0.07mm (High pixel smart camera to locate marks precisely)

    8. High precision mute type grinding screw guide to guarantee accuracy.

    9. Self-development control System can be customized as per your requirements, easy to operate.


    Specification

    The Z pindle driving power
    		 servo
    The X,Y Spindle driving power
    		 Servo 
    The screw guide rail
    		 High precision mute type grinding screw guide
    Repeatability
    		 ±0.005MM
    Products' laminating accuracy
    		 ±0.07MM
    Laminating speed
    		 0.28-0.5 seconds per time
    Applicable FPC size
    		 Min:50*50MM  Max:270*400mm (Customizable)
    Applicable adhesive size
    		 Min:0.8*3mm  MAX:30*100mm
    Power
    		 AC220V   3.0KW
    Air supply
    		 0.5-0.8MPa
    The weight of a machine
    		 About 600 kg
    Dimension 1200*1000*1720mm

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