FPC Lamination Machine

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Full Automatic Tape Label Applying Machine


Adhesive Tape die cutting and applying for PCB assembly. Suitable for 3M, Tesa, Kapton, High temperature adhesive, Pressure sensitive adhesive, PI electromagnetic, etc.

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  • Features:


    1.Wide range of application: 3M/ Tesa/ Kapton high temperature adhesive/ Pressure sensitive adhesive etc
    2. Tape cutting and applying fulfilled synchronously, high precision, high efficient, 10 times as skilled workers.
    3. Release film stripped off automatically.
    4. Cut adhesive tape into different shape with different size.
    5. Can scrape off the glue automatically to make a hand-tear.
    6. High punching/applying speed 0.28 - 0.5 sec each time.
    7. Repeatability accuracy ±0.005mm
    8. High pixel smart camera to locate marks precisely, tight tolerance ±0.07mm.
    9. HIWIN Screw Guide to guarantee accuracy.
    10. Approved by our well-known clients, the supply chain of APPLE, SAMSUNG, ZTE, FOX-LINK, TRULY, KINWONG, JZRXD, HOLITECH, SCC, SUNFLEX, QTFLEX, HI-LINK, CAREER etc 


    Application range FPC self-adhesive tape laminating
    Application field 3M/tesa/Kapton high-temperature
    resistancetapes / PI / EMI
    Laminating spindle type Sigle-spindle/pneumatic
    X,Y dynamical system Servo dynsmics
    Screw guide High precision grinding screw guide
    Repeatability tolerance ±0.005
    Products laminating tolerance ±0.075
    Laminating speed 0.4s
    Applicable product size MIN:50*50mm,MAX:270*400mm(Customized)
    Applicable self-adhesive tape size MIN:0.8*3mm,MAX:30*100mm
    Power supply/air supply AC220V 3.0KW/0.5-0.8MPa
    Equipment weight 600KGS
    Equipment size 1200*1000*1720mm


    Preview of New Products


    YTD Adhesive Film Die Cutting and Applying Machine for 3M/Tesa/Kapton

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